A Co layer, which seems to be adhesive wear, was missing on the mold surface,
and the aluminum material was adhered by being replaced from Co.
For an improvement in the adhesiveness of aluminum materials, we proposed a grade KD20 with a reduced amount of Co and a larger particle size, and the adhesion of aluminum materials improved.
We machine and process this product.
Regarding the adhesion of aluminum material, unlike partially sticked adhesion of iron-based material, the adhesion occurs and evenly forms a thin aluminum film that follows the entire surface of the mold.
Since adhesion occurs mainly against the bonded phase component, select a grade with improved adhesion resistance by reducing the bonded phase.
In this aluminum case, we improved the total adhesion effects by making the WC particle size coarser.